Storage devices for the industry

120 available

Ethernet Mini-PCIe Card | MEC-LAN-M101i

Expansion card, 1x GLAN Intel i210-IT, mPCIe, isolated, Wide Temp Features:Single-Lane (x1) PCI-Express with throughput up to 5.0/2.5GbpsFully compliant with PCI-Express Base Specification Rev. 2.0Integrated 10/100/1000 Mbps transceiverIEEE 802.3, IEEE 802.3u, IEEE 802.3ab, and IEEE 802.3z compliantIEEE 802.3x Full-Duplex flow controlComplies with EN61000-4-2(ESD) Air-15kV, Contact-8kVComplies with EN61000-4-4(EFT) 2kVComplies with EN61000-4-5 2kV Surge protection MEC-LAN-M101i is a single isolated GbE LAN module for embedded PC. The card follows the Mini PCI-e standard which is compliant with PCI Express x 1 classification and small form factor (30×50.95 mm). This board fits in any host computer that has Mini PCI-e card slots. MEC-LAN-M101i is a highly cost-effective solution to expand Gigabyte network for your computer. MEC-LAN-M101i has one Ethernet port that supports auto-negotiation 10/100/1000Mbps Ethernet connection with IEEE 802.3x flow control. MEC-LAN-M101i uses high performance, efficiency, and stability Intel I210-IT Gigabit Ethernet Controller. MEC-LAN-M101i is designed with flexibilities for many different application and accessories (daughter board, bracket, connection cable) are included in the standard package.

Item: 165816

Price on request

42 available

mSATA SSD | CIE-MST380MLF064GW

mSATA SSD, 64 GB, SATA-6G, 290/235 MB/s, 73 TBW, T380 Series, 3D TLC NAND, Wide Temp Features of the T380 Series: Compliant with SATA III 6.0Gb/s 3D TLC NAND flash memory Capacity: 64GB ~ 2TB End-to-End data protection SLC write cache technology Operating as boot disk Static and dynamic wear leveling Bad block management S.M.A.R.T. & TRIM command Models with extended temperature range Cervoz Industrial mSATA Embedded Module T380 family is a Solid State Flash Disk product that is in compliance with the mSATA and SATA III standards. mSATA T380 family fits in any mSATA sockets in a PC or motherboard; it can be used for both booting and storage purposes.T380 family uses SSD grade quality 3D NAND flash memory from the industry leading manufacturer Micron. Cervoz's firmware builds in a powerful ECC algorithm call Low-Density Parity Check (LDPC) decoding to improve data reliability.T380 family offers outstanding performance and reliability; the product family is a good cost-effective solution for semi-industrial and high-capacity storage applications.

Item: 160512

Price on request

> 1001 available

DDR4 SO-DIMM | CIR-S4SUSZ2904G

DDR4 SO-DIMM memory module, 4 GB, 260-pin, PC2933, 512Mx8 SR, Samsung, 1,2V Features:JEDEC Standard 260-pin Small Outline Dual In-Line memory moduleVoltage: 1.2VData rate: 2933 MHzOperating temperature: 0°C~+85°CNon-ECC DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 163228

Price on request

109 available

2.5" SATA-6G SSD | CIS-2ST380MMF128GW

Industrial 2.5" SATA-6G SSD, 128 GB, 470/470 MB/s, 146 TBW, T380-Series, 3D TLC NAND, Wide Temp Features of the T380 Series Compliant with SATA III 6.0Gb/s 3D TLC NAND flash memory End-to-End data protection SLC write cache technology Operating as boot disk Static and dynamic wear leveling Bad block management S.M.A.R.T. TRIM command Cervoz Industrial 2.5” SATA SSD T380 family is a high capacity Solid State Disk product that is in compliance with the 2.5” form factor and SATA III standards. The device design is based on the 7pin for data segment and 15pin for power segment standards.T380 family uses SSD grade quality 3D NAND flash memory from the industry leading manufacturer Micron. Cervoz's firmware builds in a powerful ECC algorithm call Low-Density Parity Check (LDPC) decoding to improve data reliability. This product includes various capacities to choose from.T380 family offers outstanding performance and reliability; the product family is a good cost-effective solution for semi-industrial and high-capacity storage applications.

Item: 160347

Price on request

697 available

M.2 2280 SATA-6G SSD | CIE-M8T380MLF064GS

M.2 2280 SSD, 64 GB, SATA-6G, 290/235 MB/s, 73 TBW, T380 Series, 3D TLC NAND Features of the T380-Series: Compliant with SATA III 6.0Gb/s 3D TLC NAND flash memory Capacity: 64GB ~ 2TB End-to-End data protection SLC write cache technology Operating as boot disk Product includes Standard Temperature range & Wide Temperature range Static and dynamic wear leveling Bad block management S.M.A.R.T. & TRIM command Cervoz Industrial M.2 2280 Embedded Module T380 family is a Solid State Flash Disk product that is in compliance with the M.2 and SATA III standards. M.2 2280 T380 family fits in any M.2 2280 sockets in a PC or motherboard; it can be used for both booting and storage purposes.T380 family uses SSD grade quality 3D TLC NAND flash memory from the industry leading manufacturer Micron. Cervoz's firmware builds in a powerful ECC algorithm call Low-Density Parity Check (LDPC) decoding to improve data reliability.T380 family offers outstanding performance and reliability; the product family is a good cost-effective solution for semi-industrial and high-capacity storage applications.

Item: 161841

Price on request

70 available

Serial M.2 Card | MEC-COM-2012

Expansion card, 2x RS-232, M.2 2242/2260/2280, Wide Temp Features:Single-Lane (x1) PCI-Express with throughput up to 5.0 / 2.5GbpsFully compliant with PCI-Express Base Specification Rev. 2.0Top serial transmission performance up to 921.6 Kbps baud rateFIFO 256 Bytes, 15 KV ESD protections on boardH/W, S/W automate flow control supportedEach port supports 5V or 12V power output by jumper setting MEC-COM-2012 is a serial communication card for embedded PC. The card follows the M.2 standard which is complaint with PCI Express x 1 classification and M.2 form factor. This board fits in any host computer that has M.2 slots. MEC-COM-2012 has 2 RS-232 serial ports, each individual port supports 921.6 Kbps baud rate. The combination features 15KV ESD protection, FIFO 256 Bytes, HW/SW automated flow control and extended operating temperature which enhances the board’s reliability and performance. MEC-COM-2012 is designed with flexibilities for many different applications. The power output can be configured by jumper. The accessories (bracket, connection / power input cable) are included in the standard package.

Item: 166724

Price on request

37 available

DDR4 DIMM | CIR-S4DUSZ2904G

DDR4 DIMM memory module, 4 GB, 288-pin, PC2933, 512Mx8 SR, Samsung, 1.2V Features:JEDEC Standard 288-pin Dual In-Line memory moduleVoltage: 1.2VData rate: 2933 MHzOperating temperature: 0°C~+85°CNon-ECC DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 163224

Price on request

110 available

DDR3 SO-DIMM | CIR-S3SUSOM1602G

DDR3 SO-DIMM memory module, 2 GB, 204-pin, PC1600, 256Mx8 SR, Samsung, 1.5V/1.35V Features:JEDEC standard 204-pin Small Outline Dual In-Line memory moduleVoltage: 1.5 V/1.35VData rate: 1600 MHzOperating temperature: 0°C~+85°CNon-ECC Data rates of 800, 1066, 1333, 1600, 1866 and 2133 MHz are common for DDR3 memory modules. They have 240 pins (DIMM) or 204 pins (SO-DIMM). Between 1.35 and 1.5 V are required to supply the memory modules.

Item: 158502

€19.00*

119 available

DDR3 SO-DIMM | CIR-S3SUSPM1604G

DDR3 SO-DIMM memory module, 4 GB, 204-pin, PC1600, 512Mx8 SR, Samsung, 1.5V/1.35V Features:JEDEC standard 204-pin Small Outline Dual In-Line memory moduleVoltage: 1.5 V/1.35VData rate: 1600 MHzOperating temperature: 0°C~+85°CNon-ECC Data rates of 800, 1066, 1333, 1600, 1866 and 2133 MHz are common for DDR3 memory modules. They have 240 pins (DIMM) or 204 pins (SO-DIMM). Between 1.35 and 1.5 V are required to supply the memory modules.

Item: 158504

€20.00*

73 available

DDR4 DIMM | CIR-S4DUSV2604G

DDR4 DIMM memory module, 4 GB, 288-pin, PC2666, 512Mx8 SR, Samsung, 1.2V Features:JEDEC Standard 288-pin Dual In-Line memory moduleVoltage: 1.2VData rate: 2666 MHzOperating temperature: 0°C~+85°CNon-ECC DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 155585

€22.00*

30 available

DDR4 SO-DIMM | CIR-S4SVSV2604G

DDR4 Very Low Profile SO-DIMM memory module, 4 GB, 260-pin, PC2666, 512Mx8 SR, Samsung,1.2V Features:JEDEC Standard 260-pin Small Outline Dual In-Line memory moduleVoltage: 1.2VData rate: 2666 MHzOperating temperature: 0°C~+85°CNon-ECCVery low profile DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 160668

€23.00*

69 available

DDR4 DIMM | CIR-S4DVSV2604G

DDR4 Very Low Profile DIMM memory module, 4 GB, 288-pin, PC2666, 512Mx8 SR, Samsung, 1.2V Features:JEDEC Standard 288-pin Dual In-Line memory moduleVoltage: 1.2VData rate: 2666 MHzOperating temperature: 0°C~+85°CNon-ECCVery low profile DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 155589

€23.00*

37 available

DDR3 SO-DIMM | CIR-W3SUSPSM1604G

DDR3 SO-DIMM memory module, 4 GB, 204-pin, PC1600, 512Mx8 SR, Samsung, 1.5V/1.35V, wide temperature Features:JEDEC standard 204-pin Small Outline Dual In-Line memory moduleVoltage: 1.5 V/1.35VData rate: 1600 MHzOperating temperature: -40°C~+85°CNon-ECC Data rates of 800, 1066, 1333, 1600, 1866 and 2133 MHz are common for DDR3 memory modules. They have 240 pins (DIMM) or 204 pins (SO-DIMM). Between 1.35 and 1.5 V are required to supply the memory modules.

Item: 158535

€24.00*

35 available

M.2 2242 SATA-6G SSD | CIE-M4T380MLF064GS

M.2 2242 SSD, 64 GB, SATA-6G, 290/240 MB/s, 73 TBW, T380 Series, 3D TLC NAND Features of the T380-Series: Compliant with SATA III 6.0Gb/s 3D TLC NAND Flash Capacity: 64GB ~ 1TB End-to-End data protection SLC write cache technology Operating as boot disk Static and dynamic wear leveling Bad block management S.M.A.R.T. & TRIM command Cervoz Industrial M.2 2242 Embedded Module T380 family is a Solid State Flash Disk product that is in compliance with the M.2 and SATA III standards. M.2 2242 T380 family fits in any M.2 2242 sockets in a PC or motherboard; it can be used for both booting and storage purposes.T380 family uses SSD grade quality 3D TLC NAND flash memory from the industry leading manufacturer Micron. Cervoz's firmware builds in a powerful ECC algorithm call Low-Density Parity Check (LDPC) decoding to improve data reliability.T380 family offers outstanding performance and reliability; the product family is a good cost-effective solution for semi-industrial and high-capacity storage applications.

Item: 170014

€25.00*

616 available

DDR4 DIMM | CIR-W4DUSV2604G

DDR4 DIMM memory module, 4GB, 288-pin, PC2400, 512Mx8 SR, Samsung, 1.2V, Wide Temp Features:JEDEC Standard Voltage: 1.2VData rate: 2400 MHzOperating temperature: -40°C~+85°CNon-ECC DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 159829

€26.00*

107 available

DDR4 SO-DIMM | CIR-S4SUSW2108G

DDR4 SO-DIMM memory module, 8 GB, 260-pin, PC2133, 1Gx8 SR, Samsung, 1.2V Features:JEDEC Standard 260-pin Small Outline Dual In-Line memory moduleVoltage: 1.2VData rate: 2133 MHzOperating temperature: 0°C~+85°CNon-ECC DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 167684

€30.00*

95 available

DDR4 DIMM | CIR-S4DUSW2408G

DDR4 DIMM memory module, 8 GB, 288-pin, PC2400, 1Gx8 SR, Samsung, 1.2V Features:JEDEC Standard 288-pin Dual In-Line memory moduleVoltage: 1.2VData rate: 2400 MHz Operating temperature: 0°C~+85°CNon-ECC DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 167671

€30.00*

88 available

DDR4 SO-DIMM | CIR-S4SUSW2408G

DDR4 SO-DIMM memory module, 8 GB, 260-pin, PC2400, 1Gx8 SR, Samsung, 1.2V Features:JEDEC Standard 260-pin Small Outline Dual In-Line memory moduleVoltage: 1.2VData rate: 2400 MHzOperating temperature: 0°C~+85°CNon-ECC DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 167687

€30.00*

53 available

DDR4 SO-DIMM | CIR-S4SUSY3208G

DDR4 SO-DIMM memory module, 8 GB, 260-pin, PC3200, 1Gx8 SR, Samsung, 1,2V Features:JEDEC Standard 260-pin Small Outline Dual In-Line memory moduleVoltage: 1.2VData rate: 3200 MHzOperating temperature: 0°C~+85°CNon-ECC DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 162321

€32.00*

261 available

DDR4 DIMM | CIR-S4DUSY2908G

DDR4 DIMM memory module, 8 GB, 288-pin, PC2933, 1GBx8 SR, Samsung, 1,2V Features:JEDEC Standard 288-pin Dual In-Line memory moduleVoltage: 1.2VData rate: 2933 MHzOperating temperature: 0°C~+85°CNon-ECC DDR4 supports higher density chips and stacking technologies than DDR3, enabling single memory modules with capacities of up to 512 GB. The data rates start at 2133 MHz. In contrast to the previous generation, they have 288 pins (DIMM) or 260 pins (SO-DIMM). In addition, DDR4 memory modules are more efficient than DDR3 memory modules. They consume up to 40% less power and require only 1.2 V per module.

Item: 162314

€32.00*

Industrial grade storage devices

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